Thermal spreader cap and grease containment structure for semiconductor device
AssigneeIntel Corporation
InventorDaryl James Nelson
Life of this patent
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Abstract
An apparatus and method for protecting the various components of a microprocessor is provided. The apparatus includes a thermal spreader cap that is disposed between the processor die and thermal plate, and the OLGA and thermal plate. Thermal grease layers are also provided between the thermal spreader cap and the thermal plate, the thermal spreader cap and the processor die, and the thermal spreader cap and the OLGA. The apparatus provides a compliant assembly that protects the processor die from damage due to shock and/or vibration. It also provides multiple thermal paths along which heat generated by the various components of the microprocessor may be removed, and therefore allows for a higher performance processor.
Claims21
A microprocessor assembly, comprising:
- a printed circuit board;
- a thermal plate
- a semiconductor device mounted on the printed circuit board;
- and
- a thermal spreader cap disposed between the semiconductor device and the thermal plate to provide a first thermal path for heat transfer from the semiconductor device to the thermal plate, and the thermal spreader cap also disposed between the printed circuit board and the thermal plate to provide a second thermal path for heat transfer from the semiconductor device to the thermal plate through the printed circuit board;
- wherein
- a portion of the thermal spreader cap extending past edges of the printed circuit board enhances flexibility to absorb shock or dampen vibrations imparted to the semiconductor device.
An apparatus comprising:
- a printed circuit board;
- a thermal plate;
- a semiconductor die mounted on the printed circuit board;
- and
- a thermal spreader cap disposed between the semiconductor die and the thermal plate to provide a first thermal path for heat transfer from the semiconductor die to the thermal plate, and the thermal spreader cap also disposed between the printed circuit board and the thermal plate to provide a second thermal path for heat transfer from the semiconductor die to the thermal plate through the printed circuit board;
- a portion of the thermal spreader cap extending past edges of the printed circuit board enhances flexibility to absorb shock or dampen vibrations imparted to the semiconductor die.
An apparatus, comprising:
- a printed circuit board;
- a semiconductor device coupled to said printed circuit board;
- a thermal plate;
- means for providing a first thermal path for heat transfer from the semiconductor device to the thermal plate, and a second thermal path for heat transfer from the semiconductor device to the thermal plate, through the printed circuit board whin a portion of the providing means extending past edges of the punted circuit board enhances flexibility to absorb shock or dampen vibrations imparted to the semiconductor device.
Dependencies are inferred from the claim text.