Electromagnetic interference cover for an electronics module and an electronic equipment chassis employing the same

An electronic module configured to be received within a frame of an electronic chassis and capable of generating electromagnetic emissions that cause electromagnetic interference (EMI), comprising;

• an electrical component housing having interlocking opposing sidewalls, at least one of said sidewalls being an EMI module cover comprising;
• a conductive sidepanel having a resilient cantilever member formed therefrom, said resilient cantilever member having a fixed end integrally formed with said sidepanel and a movable end free of a sidewalls coupler, thereby to allow said resilient cantilever member to flex as said electrical components housing is installed in said electronics chassis;
• and
• a boss formed proximate said movable free end and extending outwardly from said sidepanel a distance sufficient to provide a conductive path between said conductive sidepanel and an adjacent conductive surface when said module is installed in said electronic chassis.