Solvent prewet and method and apparatus to dispense the solvent prewet
AssigneeMicron Technology, Inc.
InventorJohn Whitman
Life of this patent
Estimating the term…
Abstract
A method and apparatus is provided for more efficient application of photoresist to a wafer surface. One aspect of the method comprises applying solvent to the wafer and spinning it to coat the entire wafer surface prior to the application of photoresist. This reduces surface tension on the wafer and reduces the amount of resist required to achieve a high quality film. The apparatus comprises adding a third solenoid and nozzle to the coating unit to accommodate the application of solvent to the center of the wafer surface. The method also describes incorporating a new solvent comprising diacetone alcohol, which is a low-pressure solvent, providing extended process latitudes and reduced material expenditures.
Claims29
A method of coating a wafer, comprising:
- dispensing a solvent on a wafer surface, wherein the solvent includes diacetone alcohol;
- spinning the wafer until the solvent is distributed across the wafer surface;
- dispensing a photo resist solution on the wafer;
- and
- spinning the wafer until the photo resist solution is distributed across the wafer surface.
A method of coating a wafer, comprising:
- providing a wafer processing machine that includes a prewetting nozzle;
- positioning a nozzle to dispense a solvent through the prewetting nozzle at a desired location on the wafer surface, wherein the solvent includes diacetone alcohol;
- actuating a solenoid to control solvent flow through the prewetting nozzle;
- spinning the wafer until the solvent is distributed across the wafer surface;
- dispensing a photo resist solution on the wafer;
- and
- spinning the wafer until the photo resist solution is distributed across the wafer surface.
A method of coating a wafer, comprising:
- distributing diacetone alcohol on a wafer surface;
- partially drying the wafer surface;
- and
- distributing a photo resist solution on the wafer surface.
A method of coating a wafer, comprising:
- distributing diacetone alcohol on a wafer surface;
- partially drying the wafer surface;
- and
- forming a photo resist film on the wafer surface.
A method of forming a photo resist film on a wafer, comprising:
- prewetting a wafer surface with diacetone alcohol;
- and
- forming a photo resist film on the wafer surface.
A method of forming a photo resist film on a wafer, comprising:
- dispensing diacetone alcohol on a wafer surface;
- spinning the wafer to dispense the diacetone alcohol and to partially dry the wafer surface;
- and
- forming a photo resist film on the wafer surface.
A method of forming a photo resist film on a wafer, comprising:
- dispensing diacetone alcohol on a wafer surface;
- distributing the diacetone alcohol across the wafer surface by spinning the wafer;
- dispensing a photo resist solution onto the wafer;
- and
- distributing the photo resist solution across the wafer surface by spinning the wafer.
A method of coating a wafer, comprising:
- providing a diacetone alcohol solvent;
- distributing the diacetone alcohol solvent on a wafer surface as a solvent prewet;
- and
- distributing the diacetone alcohol solvent as part of a photo resist solution on the wafer surface.
Dependencies are inferred from the claim text.