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US 6,284,661 B1Granted
Method and apparatus for producing a wafer
AssigneeDaido Hoxan Inc.
InventorsTakashi Yokoyama, Kazuma Yamamoto, Masato Yamamoto, Takahiro Mishima, Go Matsuda, Shigeki Itou
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Abstract
A method and an apparatus for cutting a wafer from a crystalline ingot, by directing a stream or streams of etching gas at the crystalline ingot in a vacuum. Waste in cutting can be greatly minimized and the work environment can also be kept clean. Further, excellent surface smoothness can be realized on the cut wafers.
Claims7
A method for cutting a wafer from a crystalline ingot exclusively by etching, comprising:
- supplying an etching gas for at least one constituent of the crystalline ingot, in a state of a molecular beam stream on the part of the crystalline ingot to be cut;
- volatilizing the cut material gradually from the surface of the ingot;
- and
- removing the cut material entirely so as to cut a wafer from the ingot.
1 more element
Dependencies are inferred from the claim text.