Semiconductor structure with a dielectric layer and its producing method
AssigneeNational Science Council
InventorsKow-Ming Chang, Ji-Yi Yang
Life of this patent
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Abstract
A semiconductor structure with a dielectric layer and its producing method are disclosed. The semiconductor structure includes a semiconductor substrate having thereon a plurality of metal lines and there are a plurality of concave regions formed between the metal lines. The dielectric layer is formed on the semiconductor by a method which can prevent the dielectric material from flowing into the concave regions. The method includes the steps of (a) providing a semiconductor substrate having thereon a plurality of metal lines forming therebetween a plurality of concave regions; and (b) forming the dielectric layer on the metal lines. The concave regions are only filled with air so that the capacitance of the semiconductor is lowered.
Claims15
A method for forming a dielectric layer comprising steps of:
- providing a semiconductor substrate having thereon a plurality of metal lines forming therebetween a plurality of concave regions;
- covering the top of a molding board with a liquid dielectric material;
- and
- putting said molding board upside down on said semiconductor substrate to form said dielectric layer on said metal lines.
A method for forming a dielectric layer comprising steps of:
- providing a semiconductor substrate having thereon a plurality of metal line forming therebetween a plurality of concave regions;
- tilting said semiconductor substrate at a particular angle, wherein said particular angle is 90 degrees angle;
- and
- dropping a liquid dielectric material on said semiconductor substrate to form said dielectric layer on said metal lines while preventing said dielectric layer from being formed inside said concave regions.
A method for forming a dielectric layer comprising steps of:
- providing a semiconductor substrate having thereon a plurality of metal lines forming therebetween a plurality of concave regions;
- tilting said semiconductor substrate at a particular angle;
- tilting a molding board at said particular angle, said metal lines and said molding board having a gap therebetween;
- and
- dropping a liquid dielectric material in said gap to form said dielectric layer.
Dependencies are inferred from the claim text.