Microsensor, and packaging method therefor

Abstract

A microsensor for use in a microgyroscope, and a packaging method therefor, are disclosed. During a bonding packaging operation for the purpose of protecting the microstructure or for the purpose of sealing it, the inside and outside of the packaged microsensor are perfectly connected together without a possibility of short circuit, so that any short circuit of the metal layer of the contact hole can be prevented. The method for packaging the microsensor includes the following steps. A structure installing part of a device wafer is etched so as to install a structure on a surface of the device wafer, and then, a sacrificial layer is formed on the part thus etched. A cavity is formed in a separate package wafer, and then, the package wafer (having a function of protection) is bonded onto a surface electrode of the device wafer thus manufactured. Then a contact hole is formed in the package wafer, for connecting the patterns of the device wafer and the package wafer together. Then a metal is deposited on the inside of the contact hole of the package wafer by applying a sputtering process.

Dependencies are inferred from the claim text.