Apparatus and method for applying process solution
AssigneeTokyo Electron Limited
InventorsMasatoshi Deguchi, Kosuke Yoshihara
Life of this patent
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Abstract
A process solution applying apparatus comprising a substrate holding mechanism for holding a substrate, a process solution supplying system for applying process solution in a prescribed amount to the substrate held by the substrate holding mechanism, the process solution supplying system having a supplying mechanism for changing a rate at which the process solution is supplied, and a substrate rotating mechanism for rotating the substrate holding mechanism, thus rotating the substrate at a predetermined speed to spread the process solution by virtue of centrifugal force and to coat the substrate with the process solution.
Claims12
A process solution applying apparatus comprising:
- a spin holder configured to hold a substrate;
- a plurality of supply systems configured to supply different types of process solutions to the substrate held by the spin holder, each of the supply systems having a supply mechanism configured to change a rate at which a process solution is supplied;
- a spin driver configured to rotate the spin holder, thereby rotating the substrate to spread a process solution by virtue of centrifugal force and to coat the substrate with the process solution;
- and
- a controller configured to control the supply systems, the controller having a storage section which stores data representing relationships between the process solutions and supply rates prescribed for the same, a selection section for selecting a process solution to be used from the process solutions, and a control section which selects a supply system corresponding to the selected process solution, and drives the supply mechanism of the selected supply system at a supply rate prescribed for the selected process solution.
A resist solution applying apparatus comprising:
- a spin holder configured to hold a substrate;
- a plurality of supply systems configured to supply different types of resist solutions to the substrate held by the spin holder, each of the supply systems having a nozzle configured to supply a resist solution, and a supply mechanism configured to change a rate at which a resist solution is supplied;
- a spin driver configured to rotate the spin holder, thereby rotating the substrate to spread a resist solution by virtue of centrifugal force and to coat the substrate with the resist solution;
- a waiting section disposed outside the spin holder, for placing the nozzles;
- a transfer system configures to pick up one of the nozzles from the waiting section and transfer the nozzle to a position above the substrate;
- and a controller configured to control the supply systems and the transfer system, the controller having a storage section which stores data representing relationships between the resist solutions and supply rates prescribed for the same, a selection section for selecting a resist solution to be used from the resist solutions, and a control section which selects a supply system corresponding to the selected resist solution, drives the transfer system to transfer a nozzle corresponding to the selected supply system, and drives the supply mechanism of the selected supply system at a supply rate prescribed for the selected resist solution, wherein each supply rate has such a value that the corresponding resist solution applied in a certain amount forms a resist solution film having a uniform thickness on an entire surface of the substrate.
Dependencies are inferred from the claim text.