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AssigneeAdvanced Micro Devices, Inc.
InventorsMichael R. Bruce, Jeffrey D. Birdsley, Rosalinda M. Ring, Rama R. Goruganthu, Brennan V. Davis
Estimating the term…
Post-manufacturing analysis of a semiconductor device is enhanced via a method and system that use a light emitting diode (LED) formed in a semiconductor die during its manufacture. According to an example embodiment of the present invention, a LED is formed within a semiconductor die having a circuit side opposite a back side. A conductor is formed that extends from the LED to the back side of the die, and is coupled to a terminal formed on the back side. The LED is activated via the terminal and used to align the die for analysis. By forming a LED within the semiconductor die during its manufacture, post manufacturing analysis is enhanced by the alignment capabilities provided by the readily activated LED.
A method for manufacturing and analyzing a semiconductor die having circuitry in a circuit side opposite a back side, the method comprising:
A system for analyzing a semiconductor die having circuitry in a circuit side opposite a back side, and having at least one LED formed within the die and coupled to a terminal via a conductor, the system comprising:
A system for analyzing a semiconductor die having circuitry in a circuit side opposite a back side, and having at least one LED formed within the die and coupled to a terminal via a conductor, the system comprising:
A method for analyzing a semiconductor die having circuitry in a circuit side opposite a back side, and having at least one LED formed within the die and coupled to a terminal via a conductor, the method comprising:
Dependencies are inferred from the claim text.