Substrate removal as a function of SIMS analysis
AssigneeAdvanced Micro Devices, Inc.
InventorsRosalinda M. Ring, Rama R. Goruganthu, Brennan V. Davis, Jeffrey D. Birdsley, Michael R. Bruce
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Abstract
Substrate removal for post-manufacturing analysis of a semiconductor device is enhanced via a method and system that utilizes ion beam etching, to etch the backside of a semiconductor chip, and utilizes SIMS as a detection technique to not only control removal of the substrate from the backside of the chip but also to determine the endpoint of the removal process. In an example embodiment there is described a method for removing substrate from the backside of a semiconductor chip as a function of detected concentration levels of a selected substrate material that is sputtered off of a region of the substrate.
Claims21
A method for removing substrate from a semiconductor chip for post-manufacturing analysis, wherein the chip has a back side opposite circuitry near a circuit side, the method comprising removing a portion of substrate in the back side of the semiconductor chip as a function of detected concentration levels of a selected substrate material that is sputtered off of a region of the substrate.
A method for removing substrate from a semiconductor chip having a back side opposite circuitry near a circuit side, the method comprising the steps of:
- (A) directing an ion beam at a portion of the substrate that generates ions that are sputtered off of the substrate, thereby removing substrate from the back side of the semiconductor chip to form an aperture;
- (B) detecting removal of a selected substrate material from the back side of the chip as the aperture is being formed;
- (C) repeating steps A and B until the detected substrate thickness reaches an endpoint;
- (D) adjusting the substrate removal rate in response to reaching the endpoint;
- (E) repeating steps A through D until a final endpoint is detected;
- and
- (F) terminating the removal process in response to detecting the final endpoint.
A system for removing substrate from a semiconductor chip having a back side opposite circuitry near a circuit side, the system comprising:
- means for removing substrate from the backside of the semiconductor chip to form an aperture;
- means for detecting removal of a selected substrate material from the back side of the chip as the aperture is being formed;
- and
- means for controlling the means for removing substrate as a function of detected concentration levels of the selected substrate material.
An apparatus for removing substrate from a semiconductor chip having a back side opposite circuitry near a circuit side, the system comprising:
- removal means that removes a portion of substrate in the backside of the semiconductor chip so as to form an aperture therein;
- detection means that detects removal of a selected substrate material from the back side of the chip as the aperture is being formed;
- and
- controller means that controls the substrate removal as a function of detected concentration levels of the selected substrate material, controller means coupled to detection means and to removal means.
A method for removing substrate from a semiconductor chip having a back side opposite circuitry near a circuit side, the method comprising:
- removing substrate from the backside of the semiconductor chip to form an aperture;
- detecting removal of a selected substrate material from the backside of the chip as the aperture is being formed;
- and
- controlling the removal of substrate as a function of detected concentration levels of the selected substrate material.
Dependencies are inferred from the claim text.