Semiconductor device inspection and analysis method and its apparatus and a method for manufacturing a semiconductor device

A method for inspecting/analyzing semiconductor devices, comprising the steps of:

• detecting a particle on a semiconductor wafer which is processed in a semiconductor device manufacturing line;
• displaying a particle selected from among said detected particles on a screen;
• measuring both position and size of said displayed particle;
• exposing said semiconductor wafer coated with a photosensitive material thereon with a light pattern having a shape according to both position and size of said measured particle so that an edge of said light pattern intersects said particle;
• etching said semiconductor wafer on which a pattern of the photosensitive material is formed by exposure of said light pattern, thereby etching a portion of said particle and exposing a cross section of said particle;
• and
• analyzing the element of said particle whose cross section is exposed.

A method for inspecting/analyzing semiconductor devices, comprising the steps of:

• detecting particles in a semiconductor wafer which is processed in a semiconductor device manufacturing line;
• etching a particle selected from among said detected particles and exposing a cross section of said selected particle;
• analyzing the element of said selected particle whose cross section is exposed;
• and
• continuing processing of said semiconductor wafer on which the element of said particle is already analyzed in said semiconductor device manufacturing line.