Cooling arrangement of a heating device of the light irradiation type

Abstract

A cooling arrangement of a heating device of the light irradiation type in which, even when the wafer is heated to a high temperature of roughly 800 to 1200° C., the respective parts, such as the arc tube portion of the lamp, the insertion tube, the sealing area and the like can be easily controlled to a suitable temperature is achieved in a heating device of the light irradiation type, in which several lamps are disposed in a light irradiation chamber, each lamp having an arc tube portion, at least one insertion tube and at least one sealing area arranged on an at least one end of the arc tube portion, by the provision of a mirror which reflects the light from the arc tube portions behind the arc tube portions of the lamps and which has opening through which the insertion portion and the sealing areas pass; a cover chamber which has a plate with opening through which the sealing area of the lamps pass, and a cover with an opening for cooling air; and a wind box which is located between the plate of the cover chamber and the mirror and which is connected via a channel to an air mover, e.g., a blower, for drawing in or blowing in a cooling air flow. The air mover is connected to the opening for cooling air in the cover via the opening of the cover chamber plate, the wind box and the channel and being connected to the opening for cooling air in the light irradiation chamber via the opening of the mirror, the wind box and the channel.

Dependencies are inferred from the claim text.