Wafer aligner system
AssigneeBerkeley Process Control, Inc.
InventorsPaul Sagues, Stephen A. Gaudio, Tim K. Wong
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AssigneeBerkeley Process Control, Inc.
InventorsPaul Sagues, Stephen A. Gaudio, Tim K. Wong
Estimating the term…
An alignment device for use with a robot for manipulating and aligning a series of semiconductor wafers with respect to an edge fiducial and the center of each wafer is disclosed. The device includes a rotary vacuum chuck for holding a wafer, and an edge detector comprising a light source that extends across the wafer edge as it moves and creates a shadow that falls on a charge coupled device (CCD) below. Output data from the CCD relative to the wafer edge position is processed by a programmable logic circuit and converted to quadrature data which is fed to the logic section of a controller. The controller is programmed to calculate the location of the wafer fiducial relative to the chuck axis and further to calculate the angular and distance offset of the wafer center from the longitudinal axis of the robot arm so that the robot arm can be moved to center the wafer with its fiducial at a preselected location before the wafer is removed from the rotary chuck.
In a system for manipulating a series of disk like elements so that each element can be transported separately by a robot having an articulated two leg arm and an end effector to a station in a precise, predetermined orientation and alignment with respect to a reference fiducial on the element edge and the geometric center of the element, said system comprising:
A method for determining the position of a fiducial on the edge of a circular wafer retained on a rotary chuck with respect to the rotary axis of the chuck comprising the steps of:
Dependencies are inferred from the claim text.