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AssigneeHewlett-Packard Company
InventorsDavid Pommerenke, David Dickey, James J DeBlanc, Victoria Tsang
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A method and apparatus is provided for reducing or eliminating the amount of electromagnetic radiation being emitted from a system assembly comprising one or more subassemblies which comprise electrical circuits which generate electromagnetic radiation. The method and apparatus of the present invention also reduce or prevent electromagnetic radiation generated by sources outside of the system assembly from interfering with and adversely affecting the electrical circuits comprised in the subassemblies. To achieve these goals, the present invention provides an electromagnetic compatibility (EMC) solution which comprises a plurality of lossy elements, and/or elements comprised of a combination of lossy and conductive material, to reduce electromagnetic radiation. Thus, the conventional EMC solution, which utilizes conductive gaskets on system assemblies and subassemblies, and which requires adequate contact between parts in order to be effective, is replaced by the EMC solution of the present invention, which is more effective at higher frequencies and does not have stringent contact requirements.
A system assembly comprising:
A method for controlling electromagnetic radiation emissions being generated by electrical circuitry comprised in one or more subassemblies of a system assembly to reduce electromagnetic radiation emission emanating from the system assembly, the system assembly comprising a housing and a plurality of subassemblies, the subassemblies being mounted within the housing, each subassembly having at least a partial enclosure for at least partially enclosing the electrical circuitry, the enclosures and the housing being comprised of a metallic material, the method comprising the steps of:
The method of 10, further comprising the step of securing an element of material to the housing that is comprised of a combination of conductive material and lossy material, wherein the element of conductive and lossy material is disposed at a location between said subassemblies.
Dependencies are inferred from the claim text.