Etching method, etching apparatus and analyzing method
AssigneeKabushiki Kaisha Toshiba
InventorsShoko Ito, Mokuji Kageyama
Life of this patent
Estimating the term…
Abstract
By locally heating or cooling a substrate in an etching process, temperature unevenness is controlled, and convection currents of an etching liquid are restricted simultaneously. By setting the etching temperature low in an initial stage of the etching process and increasing it in a final stage, uniform and quick etching is possible. In a drop etching method, generation of bubbles can be prevented to ensure uniform etching by providing gas release openings in a member opposed to the substrate.
Claims20
An etching method for etching a surface of an object by exposing the surface of the object to an etching liquid, comprising:
- heating or cooling said surface of said object, said heating or cooling being conducted unevenly on a space basis or a time basis in order to make etching of said object progress uniformly over the entirety of said surface.
An etching method for etching a surface of an object by sandwiching an etching liquid in a gap between said object and a plate member facing to said object, comprising:
- providing said plate member with a permeable means for permitting gases to pass through, and externally releasing gases generated by etching through said permeable means.
An etching apparatus for etching a surface of an object by sandwiching an etching liquid in a gap between said object and a plate member facing to said object, comprising:
- said plate member having a permeable means for externally releasing gases generated by etching.
Dependencies are inferred from the claim text.