Minimizing metal corrosion during post metal solvent clean
AssigneeAdvanced Micro Devices, Inc.
InventorsAnne E. Sanderfer, Jacques Bertrand
Life of this patent
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Abstract
The inventive method provides a wet cleaning of semiconductor devices on semiconductor wafers after photoresist is stripped. Semiconductor wafers are placed into a centrifuge carriage of a processing chamber. The centrifuge carriage rotates the semiconductor wafers. N-methylpyrrolidine heated to a temperature between 65° C. and 85° C. is sprayed onto the semiconductor wafers. Next N-methylpyrrolidine at room temperature is sprayed onto the semiconductor wafers. Finally, water at room temperature is sprayed onto the semiconductor wafers. The inventive method provides high throughput cleaning without undue corrosion or damage to metal layers.
Claims6
A method of cleaning residual photoresist from a semiconductor wafer, comprising the steps of:
- providing said semiconductor wafer having a quantity of residual photoresist thereon deposited;
- placing the semiconductor wafer into a processing chamber;
- spraying a first solvent, comprising N-methylpyrrolidine, maintained in a temperature range of 65° C. to 100° C., onto the semiconductor wafer;
- discontinuing the spraying of the first solvent onto the semiconductor wafer;
- spraying a second solvent comprising N-methylpyrrolidine, maintained in a temperature range of 20° C. to 40° C., onto the semiconductor wafer;
- discontinuing the spraying of the second solvent onto the semiconductor wafer;
- spraying water, maintained in a temperature range of 20° C. to 40° C., onto the semiconductor wafer;
- and
- discontinuing the spraying of the water onto the semiconductor wafer.
A method of cleaning residual photoresist from a semiconductor wafer, comprising the steps of:
- providing said semiconductor wafer having a quantity of residual photoresist thereon deposited;
- placing the semiconductor wafer into a centrifuge within a processing chamber and spinning the wafer;
- spraying a first solvent, comprising N-methylpyrrolidine, maintained at a temperature near the boiling point, onto the spinning semiconductor wafer;
- discontinuing the spraying of the first solvent onto the semiconductor wafer;
- spraying a second solvent comprising N-methylpyrrolidine, maintained at a temperature of approximately 20° C., onto the spinning semiconductor wafer;
- discontinuing the spraying of the second solvent onto the semiconductor wafer;
- spraying water, maintained in a temperature range of 20° C. to 40° C., onto the spinning semiconductor wafer;
- and
- discontinuing the spraying of the water onto the semiconductor wafer.
Dependencies are inferred from the claim text.