Stripper pretreatment
AssigneeShipley Company, L.L.C.
InventorJohn Cheung-Shing Chu
Life of this patent
Estimating the term…
Abstract
Disclosed are compositions useful for the pretreatment of polymeric material to be removed from substrates, such as electronic devices. The compositions of the present invention are particularly suitable for pretreating polymer residues from plasma etch processes. Also disclosed are methods of removing such pretreated polymeric material.
Claims13
A composition suitable for pretreating polymeric material to be removed from a substrate consisting essentially of one or more polyol compounds, one or more glycol ethers, water, one or more surfactants, and optionally one or more additives selected from corrosion inhibitors or chelating agents, wherein the composition is substantially free of amines, alkanolamines, hydroxylamines, tetraalkylammonium hydroxides, ammonium bifluoride, ammonium tetramethylammonium bifluoride and alkali metal hydroxides.
A method of pretreating polymeric material to be removed from a substrate comprising the step of contacting a substrate containing polymeric material to be removed with a composition suitable for pretreating polymeric material to be removed from a substrate consisting essentially of one or more polyol compounds, one or more glycol ethers, water, one or more surfactants, and optionally one or more additives selected from corrosion inhibitors or chelating agents, wherein the composition is substantially free of amines, alkanolamines, hydroxylamines, tetraalkylammonium hydroxides, ammonium bifluoride, ammonium tetramethylammonium bifluoride and alkali metal hydroxides.
A composition suitable for pretreating polymeric material to be removed from a substrate consisting essentially of one or more polyol compounds selected from (C2-C20)alkanediols, substituted (C2-C20)alkanediols, (C2-C20)alkanetriols or substituted (C2-C20)alkanetriols, one or more glycol ethers, water, one or more surfactants, and optionally one or more additives selected from corrosion inhibitors or chelating agents, wherein the composition is substantially free of amines, alkanolamines, hydroxylamines, tetraalkylammonium hydroxides, ammonium bifluoride, ammonium tetramethylammonium bifluoride and alkali metal hydroxides.
A composition suitable for pretreating polymeric material to be removed from a substrate consisting essentially of one or more polyol compounds selected from ethylene glycol, propylene glycol, diethylene glycol, dipropylene glycol, triethylene glycol, tripropylene glycol, 2-methyl-1,3-propanediol, butanediol, pentanediol, hexanediol, or glycerol, one or more glycol ethers, water, one or more surfactants, and optionally one or more additives selected from corrosion inhibitors, co-solvents or chelating agents, wherein the composition is substantially free of amines, alkanolamines, hydroxylamines, tetraalkylammonium hydroxides, ammonium bifluoride, ammonium tetramethylammonium bifluoride and alkali metal hydroxides.
Dependencies are inferred from the claim text.