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AssigneeNitto Denko Corporation
InventorsYasufumi Miyake, Tetsuya Terada, Kenkichi Yagura, Chiharu Miyaake, Toshihiko Sugimoto
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The present invention provides a rigid circuit member obtained by bending a composite laminate comprising a circuit conductor made of a metal foil interposed between plastic films having an elastic modulus of not less than 450 kg/mm2 with an adhesive, characterized in that as said plastic film there is used a polyethylene naphthalate film. The present invention also provides a circuit board adapted to be connected to a conductor on a rigid substrate, characterized in that said circuit conductor is interposed between polyethylene naphthalate films. The present invention further provides a printed circuit board, comprising a polyethylene naphthalate film having an elastic modulus of not less than 500 kg/mm2, not more than 1.5×10−5/° C., a hygroscopic expansion coefficient of not more than 1.2×10−5/%RH, a water vapor permeability of not more than 15 g/m2/mil day, a percent water absorption of not more than 2% and a melting point of not higher than 280° C. and a conductor circuit integrated into a laminate with an adhesive layer provided interposed therebetween.
A rigid circuit member obtained by bending a composite laminate into a predetermined shape, the rigid circuit member comprising a circuit conductor made of a metal foil and interposed between plastic films having an elastic modulus ranging from about 450 kg/mm2 to about 550 kg/mm2, a thermal expansion coefficient of not more than 1.5×10−5/° C., a hygroscopic expansions coefficient of not more than 1.2×10−5/%RH, and a water vapor permeability of not more than 15 g/m2/mil day with an adhesive, wherein a polyethylene naphthalate film is used as the plastic film and wherein the rigid circuit member substantially retains the predetermined shape.
A circuit board connected to a conductor on a rigid substrate, the circuit board comprising a circuit conductor being interposed between polyethylene naphthalate films wherein the polyethylene naphthalate films have an elastic modulus ranging from about 450 kg/mm2 to about 550 kg/mm2, a thermal expansion coefficient of not more than 1.5×10−5/° C., a hygroscopic expansions coefficient of not more than 1.2×10−5/%RH, a water vapor permeability of not more than 15 g/m2/mil day.
A circuit board connected to a conductor on a rigid substrate, the circuit board comprising a circuit conductor being interposed between polyethylene naphthalate films wherein said rigid substrate is a glass substrate having a transparent electrode provided thereon.
A printed circuit board comprising a polyethylene naphthalate film having an elastic modulus ranging from about 500 kg/mm2 to about 800 kg/mm2, a thermal expansion coefficient of ranging from about 0.3×10−5/° C. to about 1.5×10−5/° C., a hygroscopic expansions coefficient ranging from about 0.8×10−5/%RH to about 1.2×10−5/%RH, a water vapor permeability of not more than 15 g/m2/mil day, a percent water absorption of not more than 2% and a melting point of not higher than 280° C. and a conductor circuit, which are integrated into a laminate with an adhesive layer provided interposed therebetween.
A printed circuit board comprising a polyethylene naphthalate film having an elastic modulus of not less than 500 kg/mm2, a thermal expansion coefficient of not more than 1.5×10−5/° C., a hygroscopic expansions coefficient of not more than 1.2×10−5/%RH, a water vapor permeability of not more than 15 g/m2/mil day, a percent water absorption of not more than 2% and a melting point of not higher than 280° C. and a conductor circuit which are integrated into a laminate with an adhesive layer provided interposed therebetween, wherein said adhesive comprises the following ingredients (A) to (E):
Dependencies are inferred from the claim text.