Avionics rack with external electronics module
OwnerRichard A. Matonis, David M. Smith +1inventors
InventorsRichard A. Matonis, David M. Smith, John J. Arena
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OwnerRichard A. Matonis, David M. Smith +1inventors
InventorsRichard A. Matonis, David M. Smith, John J. Arena
Estimating the term…
A rack (70) for a plurality of internal electronics modules that includes a mechanism for mounting external electronics modules (69). The rack (70) includes a heat exchanger (63) disposed between the rack (70) and the external electronics module (69). The external electronics module (69) includes a heat coupling surface for efficiently using the heat exchanger (63) for dissipating heat of the external electronics module (69).
An electronics rack comprising:
Dependencies are inferred from the claim text.
No related US applications are recorded in the indexed filing history.
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For racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment: air circulating in closed…
For securing or extracting printed circuit boards: by edge clamping, e.g. wedges
Printed circuits
Term ended 31 May 2020 (estimated)
USPTO file history isn’t available for this patent, so only indexed dates are shown.
1. Field of the Invention
This invention relates generally to a rack for mounting and connecting a plurality of electronics modules and, more particularly, to a rack for mounting and connecting a protected external module, which is coupled to a heat exchange unit.
2. Discussion of the Related Art
FIG. 1 is a perspective view of a rack, known in the art, for mounting a plurality of electronics modules;
FIG. 2 is a cross-sectional view through line 2—2 of rack shown in FIG. 1;
FIG. 3 is a perspective view of a rack for mounting a plurality of electronic modules, where the rack includes mounting for an external electronic module, according to an embodiment of the present invention;
The following discussion of the preferred embodiments is directed to a rack having a plurality of heat exchangers for electronic modules is merely exemplary in nature, and is no way intended to limit the invention or its applications or uses.
FIG. 3 is a perspective view of an electronics rack 70, according to an 16 embodiment of the present invention. FIGS. 4-7 are views of the external electronics module 68. The rack 70 can be used to hold and connect the same types of internal electronics modules 36 as the rack 10, and therefore like components are defined by the same reference numerals and are described above. The rack 70 can also be used to hold and connect a plurality of external electronic modules 68 onto the top surface 71 of the top heat exchanger 63. Unlike the internal electronics modules 36, which are mounted with the rack 70, the external electronics module 68 is mounted to the rack 70 top surface 71. Volume efficiency is improved since no additional volume needs to be allocated for heat exchangers 60, 63. The external electronics module uses the existing racks 70 features for cooling. The external electronics module cover 74 provides its internal components environmental protection. In this embodiment, a single external electronics module is shown, but in alternate designs, variations in the numbers of modules coupled to the top heat exchanger 63 may be desired.
Each external electronics module 68 has a pair of parallel wedge clamps 78, 79 which are mounted to a coupling surface 76 of the external electronics module cover 74. The coupling surface 76 is preferably aluminum and allows for a proper thermal coupling of the external electronics module 68 with the top surface 71 of the top heat exchanger 63.