Thick-film conductor circuit and production method therefor
AssigneeAsahi Kasei Kabushiki Kaisha
InventorsKozo Yoshida, Kenichi Sakabe
Life of this patent
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Abstract
A method for manufacturing a thick-film conductor circuit. The method of manufacture comprises: employing a conductive substrate which is an aluminum plate processed with basic solution containing zinc; coating the surface of the conductive substrate with a liquid photosensitive resin composition; exposing a portion, in which a resin pattern must be formed, to a high-energy beam; dissolving or dispersion-removing a non-exposed portion of the photosensitive resin composition with developing solution so that a required resin pattern is formed on the conductive substrate; immersing the conductive substrate in plating solution while voltage is applied so that a conductor is formed by electrolytic plating; and removing the conductive substrate.
Claims10
A method of manufacturing a thick-film conductor circuit comprising the steps of:
- employing a conductive substrate which is an aluminum plate processed with basic solution containing zinc;
- coating the surface of the conductive substrate with a liquid photosensitive resin composition;
- exposing a portion, in which a resin pattern must be formed, to a high-energy beam;
- dissolving or dispersion-removing a non-exposed portion of the photosensitive resin composition with developing solution so that a required resin pattern is formed on the conductive substrate;
- immersing the conductive substrate in plating solution while voltage is applied so that a conductor is formed by electrolytic plating;
- and removing the conductive substrate.
A method of manufacturing a thick-film conductor circuit comprising the steps of:
- coating the surface of a conductive substrate with a liquid photosensitive resin composition;
- exposing a portion, in which a resin pattern must be formed, to a high-energy bean;
- dissolving or dispersion-removing a non-exposed portion of the photosensitive resin composition with developing solution so that a required resin pattern is formed on the conductive substrate;
- forming a conductor by electrolytic plating;
- and removing the conductive substrate, wherein
- the liquid photosensitive resin composition contains prepolymer having an ethylene unsaturated group, polymerizable monomer, a light polymerization initiator and a photoabsorber,
- the prepolymer is unsaturated polyester resin which is obtainable from condensation of a dicarboxylic acid component and a diol component and which has a number average molecular weight of 500 to 5,000, the dicarboxylic acid component contains compound (a) having a component expressed by the following chemical formula (1) at a molar ratio of 0.1 to 0.4 and compound (b) having a component expressed by the following chemical formula (2) at a molar ratio of 0.1 to 0.4 when the overall molar ration of the dicarboxylic acid component is 1:
- where R1 and R2 are each —COOH or —CH2COOH and R3 and R4 are each —H or —CH3,
- the polymerizable monomer component contains at least one type of a compound which has at least there aclyloyl groups or methacryoyl groups in one molecule thereof and which is combined with carbon atoms to which the aclyloyl group or the methacryoyl group is combined such that fifteen or less carbon atoms and/or oxygen atoms exist in such a manner that the compound is contained by 1 part by weight to 3 parts by weight with respect to 100 parts by weight of the prepolymer,
- a light polymerization initiator having a molar absorbance coefficient of 5 l/mol·cm to 1000 l/mol·cm is contained in a quantity of 0.01 wt % to 10 wt % and a photoabsorber in a quantity of 0.01 wt % to 7 wt %, and
- the light transmittance is 15% to 75%.
Dependencies are inferred from the claim text.