Method of forming a thin film on a substrate of a semiconductor device
AssigneeKaneka Corporation
InventorsMasataka Kondo, Katsuhiko Hayashi, Eiji Kuribe
Life of this patent
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Abstract
A method of manufacturing a semiconductor device having a substrate with a thin film formed thereon, the method including washing the substrate with a washing liquid, removing the washing liquid from the substrate by blowing a compressed air to the substrate washed, and forming a thin film on the substrate immediately after blowing the compressed air on the substrate without performed another step, wherein the compressed air to be blown on the substrate may be pre-heated or ionized and the substrate may be washed with an inert gas in the form of plasma before the thin film is formed.
Claims14
A method of manufacturing a semiconductor device by forming a thin film on a substrate, comprising the steps of:
- (a) washing the substrate with a washing liquid;
- (b) removing the washing liquid from the substrate by blowing a compressed pre-heated air to the substrate washed;
- and
- (c) forming a thin film on the substrate immediately after the step (b), without performing another step .
A method of manufacturing a semiconductor device by forming a thin film on a substrate, comprising the steps of:
- (a) washing the substrate with a washing liquid;
- (b) removing the washing liquid from the substrate by blowing a compressed ionized air to the substrate washed;
- and
- (c) forming a thin film on the substrate immediately after the step (b), without performing another step.
A method of manufacturing a semiconductor device by forming a thin film on a substrate, comprising the steps of:
- (a) washing the substrate with a washing liquid;
- (b) washing the substrate with an inert gas in the form of plasma;
- (c) removing the washing liquid from the substrate by blowing a compressed air to the substrate washed;
- and
- (d) forming a thin film on the substrate immediately after the step (b), without performing another step.
Dependencies are inferred from the claim text.