Method of fabricating interconnects
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorChine-Gie Lou
Life of this patent
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Abstract
A method for fabricating interconnects is described. A semiconductor substrate having metal lines is provided. A liner layer is formed over the substrate, and then a dielectric layer is formed between the metal lines, wherein the dielectric layer has a low dielectric constant. Patterned thermal conductivity layers are formed surrounding the predetermined regions of vias. Thereafter, another dielectric layer with low dielectric constant is formed between the patterned thermal conductivity layers, and then a planar cap layer is formed over the substrate. Via openings exposing the metal lines are formed in the planar cap layer, the patterned thermal conductivity layer and the liner layer. A metal material is filled in the via openings to form vias.
Claims18
A method of fabricating a interconnect, comprising the steps of:
- providing a substrate having a plurality of metal lines formed thereon;
- forming a liner layer over the substrate to cover the metal lines;
- forming a first dielectric layer between the metal lines;
- forming a plurality of patterned thermal conductivity layers over the substrate;
- forming a second dielectric layer between the patterned thermal conductivity layers;
- forming a cap layer over the substrate;
- forming a plurality of via openings in the cap layer, the patterned thermal conductivity layers and the liner layer to expose the metal lines;
- and
- filling on the via openings with a metal layer to form a plurality of vias.
A method of fabricating a interconnect, comprising the steps of:
- providing a substrate having a plurality of metal lines formed thereon;
- forming a liner layer over the substrate to cover the metal lines;
- forming a first dielectric layer between the metal lines;
- forming a plurality of patterned thermal conductivity layers with a dummy line form over the substrate;
- forming a second dielectric layer between the patterned thermal conductivity layers with the dummy line form;
- forming a cap layer over the substrate;
- forming a plurality of via openings in the cap layer, the patterned thermal conductivity layers and the liner layer to expose the metal lines;
- and
- filling the via openings with a metal layer to form a plurality of vias.
A method of fabricating a interconnect, comprising the steps of:
- providing a substrate having a plurality of metal lines formed thereon;
- forming a liner layer over the substrate to cover the metal lines;
- forming a first dielectric layer on the liner layer, wherein the first dielectric layer has a low dielectric constant;
- removing a part of the first dielectric layer to leave the first dielectric layer between the metal lines;
- forming a thermal conductivity layer over the substrate;
- patterning the thermal conductivity layer to form a plurality of dummy lines;
- forming a second dielectric layer over the substrate, wherein the second dielectric layer has a low dielectric constant;
- removing a part of the second dielectric layer to leaving the second dielectric layer between the dummy lines;
- forming a cap layer over the cap layer;
- forming a photoresist over the substrate;
- performing an etching process using the photoresist as a mask to form a plurality of via openings in the cap layer, the dummy lines and the liner layer to expose the metal lines;
- removing the photoresist;
- and
- filling the via openings with a metal layer to form a plurality of vias.
Dependencies are inferred from the claim text.