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US 6,271,114 B1Granted
System for adjusting the size of conductive lines based upon the contact size
AssigneeAdvanced Micro Devices, Inc.
InventorH. Jim Fulford
Life of this patent
Estimating the term…
Abstract
The present invention is directed to a method of forming conductive interconnections in an integrated circuit device to optimize or at least maintain the speed at which signals propagate throughout the integrated circuit device. In one embodiment, the method comprises determining any variation in the size of a contact, as compared to its design size, and varying the size of a conductive line to be coupled to the contact based upon the variation in the size of the contact.
Claims50
A system, comprising:
- a metrology tool for determining a size of a contact;
- and
- a process layer manufacturing tool adapted to vary, based upon the determined size of said contact, a thickness of a process layer used in the manufacturing of a conductive line to be coupled to said contact.
A system, comprising:
- a metrology tool for determining a size of a via formed in a layer of dielectric material in which a contact will be formed;
- and
- a process layer manufacturing tool adapted to vary, based upon the determined size of said via, a thickness of a process layer used in the manufacturing of a conductive line to be coupled to said contact.
A system, comprising:
- a metrology tool for determining a variation in a size of a contact as compared to a design size of said contact;
- and
- a process layer manufacturing tool adapted to vary, based upon said determined size variation, a thickness of a process layer used in the manufacturing of a conductive line to be coupled to said contact.
A system, comprising:
- a metrology tool for determining a variation in a size of a via in which a contact will be formed as compared to a design size for said via;
- and
- a process layer manufacturing tool adapted to vary, based upon said determined size variation of said via, a thickness of a process layer used in the manufacturing of a conductive line to be coupled to said contact.
A system, comprising:
- a metrology tool for determining a variation in a physical dimension of at least one of a via and a contact to be formed in said via;
- and
- a process layer manufacturing tool adapted to vary, based upon said determined physical dimension of said at least one of a via and a contact, a thickness of a process layer used in the manufacturing of a conductive line to be coupled to said contact.
Dependencies are inferred from the claim text.