Mounting for high frequency device packages
OwnerWayne K. Pfaffinventor
Life of this patent
Estimating the term…
Abstract
Test and/or burn-in sockets for high frequency electronic device packages are formed using contact pins having parallel ends joined by a support beam supported so that one end of the pin extends through a guide into a cavity in the socket and the other end extends through a second guide displaced from the first guide. The outer ends of the contact pins are arranged to contact input/output lands of a external circuitry such as a burn-in board or the like and the inner ends arranged to contact input/output leads or lands on an electronic LGA package. The end portions of the contact pins are constrained in parallel guides which are arranged to precisely align the ends of the pins with the terminal lands and the length and size of the contact pins are minimized to minimize signal distortion.
Claims35
Mounting apparatus for an electronic device package comprising:
- (a) a support base;
- (b) a guide plate having a first set of substantially parallel guides;
- (c) a second set of substantially parallel guides oriented substantially parallel with and spaced from said first set of substantially parallel guides;
- and
- (d) at least one contact pin having first and second substantially parallel end portions interconnected by a support beam with said first end portion extending through and constrained by a guide in said first set of parallel guides and the second end portion extending through a guide in said second set of substantially parallel guides and said support beam extending between a first cavity surrounding the end of said support beam which supports said first end portion and a second cavity surrounding the end of said support beam which supports said second end portion.
Mounting apparatus for an electronic device package comprising:
- (a) a support base;
- (b) a guide plate having a first set of substantially parallel guides;
- (c) a second set of substantially parallel guides oriented substantially parallel with and spaced from said first set of substantially parallel guides;
- and
- (d) at least one contact pin having first and second substantially parallel end portions interconnected by a support beam with said first end portion extending through and constrained by a guide in said first set of parallel guides and the second end portion extending through a guide in said second set of substantially parallel guides and said first end portion and said second end portion of said contact pin terminating in substantially the same plane.
Mounting apparatus for an electronic device package comprising:
- (a) a guide plate having a first set of substantially parallel guides arranged to be aligned with interconnection terminal surfaces on an electronic device package;
- (b) a second set of substantially parallel guides oriented substantially parallel with and spaced from said first set of substantially parallel guides;
- and
- (c) at least one contact pin having first and second substantially parallel end portions interconnected by a support beam which is not parallel with said end portions with said first end portion extending through and constrained by a guide in said first set of parallel guides and the second end portion supported in a guide in said second set of substantially parallel guides.
The combination comprising:
- (a) mounting apparatus including:
- (i) a guide plate having a first set of substantially parallel guides;
- (ii) a second set of substantially parallel guides oriented substantially parallel with and spaced from said first set of substantially parallel guides;
- and
- (iii) at least one contact pin having first and second substantially parallel end portions interconnected by a support beam with said first end portion extending through and constrained by a guide in said first set of parallel guides and the second end portion extending through a guide in said second set of substantially parallel guides;
- and
- (b) a circuit board having input/output terminal lands secured to said mounting apparatus with at least one of said input/output terminal lands in contact with one of said second end portions projecting through a guide in said second set of substantially parallel guides.
Mounting apparatus for an LGA package comprising:
- (a) a guide plate having a first set of substantially parallel guides arranged to be aligned with contact pads on an LGA package and a second set of substantially parallel guides oriented substantially parallel with and spaced from said first set of substantially parallel guides;
- (b) at least one contact pin having first and second substantially parallel end portions interconnected by a support base which is not parallel with said end portions with said first end portion extending through a guide in said first set of parallel guides and the second end portion positioned in a guide in said second set of substantially parallel guides;
- and
- (c) a support retaining the second end portion in a substantially fixed position.
Mounting apparatus for an LGA package comprising:
- (a) a support base;
- (b) a guide plate having a first set of substantially parallel guides arranged to be aligned with contact pads on an LGA package;
- (c) a second set of substantially parallel guides oriented substantially parallel with and spaced from said first set of substantially parallel guides;
- and
- (d) at least one contact pin having first and second substantially parallel end portions interconnected by a support beam which is not parallel with said end portions with said first end portion extending through and constrained by a guide in said first set of parallel guides and the second end portion extending through a guide in said second set of substantially parallel guides.
The combination comprising:
- (a) mounting apparatus including:
- (i) a support base;
- (ii) a guide plate having a first set of substantially parallel guides;
- (iii) a second set of substantially parallel guides oriented substantially parallel with and spaced from said first set of substantially parallel guides;
- and
- (iv) at least one contact pin having first and second substantially parallel end portions interconnected by a support beam with said first end portion extending through and constrained by a guide in said first set of parallel guides and the second end portion extending through a guide in said second set of substantially parallel guides;
- and
- (b) a circuit board having input/output terminal lands secured to said mounting apparatus with at least one of said input/output terminal lands in contact with one of said second end portions projecting through a guide in said second set of substantially parallel guides.
Mounting apparatus for an LGA package comprising:
- (a) a support base;
- (b) a guide plate having a first set of substantially parallel guides;
- (c) a second set of substantially parallel guides oriented substantially parallel with and spaced from said first set of substantially parallel guides;
- and
- (d) at least one contact pin having first and second substantially parallel end portions interconnected by a support beam with said first end portion extending through and constrained by a guide in said first set of parallel guides and the second end portion extending through a guide in said second set of substantially parallel guides and said support beam extending between a first cavity surrounding the end of said support beam which supports said first end portion and a second cavity surrounding the end of said support beam which supports said second end portion.
Mounting apparatus for an LGA package comprising:
- (a) a support base;
- (b) a guide plate having a first set of substantially parallel guides;
- (c) a second set of substantially parallel guides oriented substantially parallel with and laterally spaced from said first set of substantially parallel guides;
- and
- (d) at least one contact pin having first and second substantially parallel end portions interconnected by a support beam which extends laterally between said parallel end portions with said first end portion extending through and constrained by a guide in said first set of parallel guides and the second end portion extending through a guide in said second set of substantially parallel guides.
Dependencies are inferred from the claim text.