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US 6,269,864 B1Granted
Parallel-plate/pin-fin hybrid copper heat sink for cooling high-powered microprocessors
AssigneeIntel Corporation
InventorAshok N. Kabadi
Life of this patent
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Abstract
A heat sink for a microprocessor includes a thermally conductive base having a plurality of fin structures upwardly extending from the thermally conductive base. The plurality of fin structures having a first surface comprising a plurality of surface area enhancer structures to increase a convection surface area of the heat sink for a given volume of a heat sink to enhance heat dissipation from the heat sink.
Claims28
A heat sink, comprising:
- a thermally conductive base;
- and
- a plurality of fin structures extending upwardly from the thermally conductive base, wherein the plurality of fin structures have a generally planar first surface comprising a first plurality of surface area enhancer structures, wherein the first plurality of surface area enhancer structures have a base approximately in the range of about 0.015 inches to 0.035 inches, and a height from the base approximate in the range of about 0.025 inches to 0.05 inches, wherein the heat sink has a top surface on the fin structures, and a plurality of tabs extend upwardly from the top surface of the fin structures.
A heat sink assembly, comprising:
- a heat sink having a thermally conductive base, and a plurality of fin structures laterally and upwardly extending from the thermally conductive base, wherein the plurality of fin structures have generally planar first and second surfaces, wherein the first and second surfaces comprise a plurality of surface area enhancer structures extending outwardly from the first and second surfaces, and wherein the plurality of fin structures are separated by a predetermined gap, wherein the surface area enhancer structures have a base approximately in the range of about 0.015 inches to 0.035 inches, and a height from the base approximately in the range of about 0.025 inches to 0.05 inches, wherein the heat sink has a top surface on the fin structures, and a plurality of tabs extend upwardly from the top surface of the fin structures;
- a fan attached to a top surface of the heat sink to introduce a convection medium between the plurality of fin structures;
- and
- a circuit package, thermally coupled to a bottom surface of the thermally conductive base.
1 more element
A method of increasing a heat sink convection surface area, the method comprising:
- providing a first plurality of surface area enhancer structures on a generally planar first surface of a plurality of fin structures of the heat sink by chemically etching the first surface of the plurality of fin structures, wherein the first plurality of surface area enhancer structures have a base approximately in the range of about 0.015 inches to 0.035 inches, and a height from the base approximately in the range of about 0.025 inches to 0.05 inches.
A method of dissipating heat from a microprocessor comprising:
- providing a plurality of surface area enhancer structures on a generally planar first and second surfaces of a plurality of fin structures of the heat sink by chemically etching the first and second surfaces to increase a convection surface area of a heat sink, wherein the surface area enhancer structures have a base approximately in the range of about 0.015 inches to 0.035 inches, and a height from the base approximately in the range of about 0.025 inches to 0.05 inches, wherein the plurality of fin structures have a predetermined gap between the fin structures;
- attaching a fan to the plurality of fin structures such that a convection medium can be introduced through the predetermined gap and around the plurality of surface area enhancer structures;
- and
- attaching the heat sink to the microprocessor to dissipate heat from the microprocessor.
1 more element
Dependencies are inferred from the claim text.