Method of drying substrates and drying apparatus
AssigneeTokyo Electron Limited
InventorsYoshiyuki Honda, Akira Koguchi, Eiji Masuda
Life of this patent
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AssigneeTokyo Electron Limited
InventorsYoshiyuki Honda, Akira Koguchi, Eiji Masuda
Estimating the term…
A substrate transporting device and method 19 transports a plurality of wafers W standing upright in a row, from a previous process, i.e., a cleaning process. A substrate holder 40 is carried by a transporting device 50 arranged outside a drying chamber 20. The substrate holder 40 receives the wafers W from the substrate transporting device 19 while maintaining a posture of the wafers W. The transporting device 50 lowers the substrate holder 40 and sequentially moves it into the drying chamber 20 through an unloading and loading port 21 above the drying chamber 20. Thereafter, the substrate holder 40 is fixed to a rotor 30. After closing the unloading and loading port 21 with a lid body 25, the rotor 30 is rotated. In this way, moisture sticking to surfaces of the wafers W is eliminated.
A drying apparatus for drying substrates to be processed, comprising:
A drying apparatus for drying substrates to be processed, comprising:
A drying apparatus for drying substrates to be processed, comprising:
A drying apparatus for drying substrates to be processed, comprising:
A drying apparatus for drying substrates to be processed, comprising:
A drying apparatus for drying substrates to be processed, comprising:
A method of drying substrates to be processed, said method comprising the steps of:
A drying apparatus for drying substrates to be processed, comprising:
A drying apparatus for drying substrates to be processed, comprising:
A drying apparatus for drying substrates to be processed, comprising:
Dependencies are inferred from the claim text.
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No related US applications are recorded in the indexed filing history.
For cleaning followed by drying, rinsing, stripping, blasting or the like: for drying
Generic processes or apparatus for the manufacture or treatment of devices covered
Term ended 17 Nov 2018 (estimated)
USPTO file history isn’t available for this patent, so only indexed dates are shown.
1. Field of the Invention
The present invention relates to a drying apparatus for drying substrates to be processed, such as semiconductor wafers and LCD (liquid crystal display) glass substrates etc., and a method of drying the substrates.
2. Description of the Related Art
The above and other features and advantages of this invention will become apparent, and the invention itself will best be understood, from a study of the following description and appended claims, with reference had to the attached drawings showing a preferred embodiment of the invention.
FIG. 1 is a schematic plan view of a cleaning system to which a substrate drying apparatus in accordance with the present invention is applied;
FIG. 2 is a side view of the substrate drying apparatus of the present invention, showing the whole constitution of the apparatus schematically;
An embodiment of the present invention will be described with reference to drawings, taking an instance of applying a drying apparatus of the invention on to a cleaning system for semiconductor wafers.
At first, we now describe an overall constitution of the cleaning system. As shown in FIG. 1, the cleaning system mainly comprises: a loading and unloading section 2 for loading and unloading a container for accommodating wafers W horizontally, namely a carrier 1; a processing section 3 for cleaning the wafers W by using chemicals, cleaning liquids etc. and sequentially drying them; and an interface section 4 positioned between the loading and unloading section 2 and the processing section 3, for delivering the wafers W from the section 2 to the section 3 and vice versa, adjusting the position of the wafers W and for changing the posture of the wafers W.
The loading and unloading section 2 is constituted by an input (loading) part 5 and an output (unloading) part 6, both of which are juxtaposed on one side of the cleaning system. In order to load the carriers 1 to the input part 5 and unload them from the output part 6, slide tables (not shown) are respectively provided in a carrier input port 5a and a carrier output port 5b of the input part 5.