Method of and apparatus for bonding component
AssigneeFuji Photo Film Co., Ltd.
InventorKiyohumi Yamamoto
Life of this patent
Estimating the term…
Abstract
A bonding apparatus for bonding a component on a board at a predetermined position thereon has a displacement mechanism for displacing a board holding unit for holding a board and a component holding unit for holding a component relatively to each other to reach a bonding position, a laser distance measuring mechanism for measuring a distance of said board holding unit or said component holding unit from said bonding position directly with a laser beam, and an imaging mechanism for detecting a position of said component with cameras and positionally correcting the component if necessary. The bonding apparatus allows components, i.e., LED chips, to be positioned highly accurately without being affected by spaced intervals between the components.
Claims9
A method of bonding a component on a board at a predetermined position thereon, comprising the steps of:
- displacing board holding means for holding a board and component holding means for holding a component relatively to each other to reach a bonding position;
- measuring a distance of said board holding means or said component holding means from said bonding position directly with a laser beam;
- and
- detecting a position of said component with cameras and positionally correcting the component if necessary.
An apparatus for bonding a component on a board at a predetermined position thereon, comprising:
- a displacement mechanism for displacing a board holding means for holding a board and a component holding means for holding a component relatively to each other to reach a bonding position;
- a laser distance measuring mechanism for measuring a distance of said board holding means or said component holding means from said bonding position directly with a laser beam;
- and
- an imaging mechanism for detecting a position of said component with cameras and positionally correcting the component if necessary.
Dependencies are inferred from the claim text.