Vertical furnace for the treatment of semiconductor substrates
AssigneeAdvanced Semiconductor Materials International, N.V.
InventorsJacobus Pieter Buijze, Jeroen Jan Stoutjesdijk, Christianus Gerardus Maria De Ridder, Hubertus Johannes Julius Stohr
Life of this patent
Estimating the term…
Abstract
The treatment chamber in the furnace is delimited by a liner of refractory material. In order to increase the life thereof and in particular to restrict the sensitivity to deposits deposited by the process gas fed through the furnace, it is proposed to make the liner of a silicon carbide material. To seal the furnace chamber, a second liner of quartz material is placed around a liner of this type and the gap between the two liners is flushed.
Claims12
A vertical furnace for the treatment of semiconductor substrates under reduced pressure, comprising a treatment chamber delimited by a first liner made of refractory material, around which a second liner made of quartz material is arranged essentially concentrically, and wherein a heating element is arranged outside the second liner, characterized in that the first liner comprises SiC and is fitted such that it is stationary, and in that the first and the second liner are provided with, respectively, a first and a second nozzle at the top, the second nozzle being arranged essentially concentrically around the first nozzle, the free end of at least one nozzle being connected to the remainder of the furnace via a seal which permits movement wherein the gap between the first and second liner can be put under reduced pressure and the second liner is sealed relative to the surroundings, said furnace including at least one discharge for placing the furnace under reduced pressure.
Vertical furnace according to claims, wherein the first nozzle comprises a separate part of refractory material, which is clamped between, on one side, the top of said first liner and, on the other side, the other part of said furnace.
Vertical furnace according to one of the preceding claims, wherein an inlet for process gas connects to the first nozzle and an inlet for flushing gas connects to the second nozzle.
A Method for treating a semiconductor substrate in a vertical furnace at a pressure lower than 2 Torr comprising a double-walled liner, said method comprising:
- introducing a processed gas into a treatment chamber delimited by a first liner, and
- introducing a flushing gas into the gap between the first liner and a surrounding second liner, wherein a quantity of the flushing gas metered in is at least 50 times less than a quantity of the treatment gas metered in, and wherein the furnace is provided with a discharge, which is under a reduced pressure, for said gases.
A method for treating a semiconductor substrate in a vertical furnace comprising:
- introducing a process gas into a treatment chamber delimited by a first liner made of SiC material;
- introducing a flushing gas into a gap between the first liner and a surrounding second liner made of quartz material, the first and second liners being provided with, respectively, a first and a second nozzle at the top, the second nozzle being arranged essentially concentrically around the first nozzle, the free end of at least one nozzle being connected to the remainder of the furnace by way of a seal;
- and
- applying a reduced pressure to the chamber and to the gap, the second liner being sealed relative to the surroundings.
Dependencies are inferred from the claim text.