Optical module
AssigneeNEC Corporation
InventorHiroshi Honmou
Life of this patent
Estimating the term…
Abstract
An electrode of a laser diode (LD) is joined with a Si substrate via a solder layer. A cavity region is formed directly under the LD in the solder layer. The solder layer spreads outside the cavity region. Since there arises no stress in a space of the cavity region, the internal stress of the active layer, which is formed directly over the cavity region, is relaxed as compared with that in a conventional optical module, which is provided with no cavity region in the solder layer. Accordingly, a highly reliable optical module can be obtained.
Claims10
An optical module, comprising:
- an optical device provided with a first electrode formed on a bottom surface thereof,
- a substrate provided with a second electrode formed on a top surface thereof,
- a solder layer region for joining said first and second electrodes, and
- a cavity region formed under said optical device in said solder layer region.
An optical module, comprising:
- an optical device provided with a first electrode formed on a bottom surface thereof,
- a substrate provided with a second electrode formed on a top surface thereof,
- a solder layer region for joining said first and second electrodes, and
- a cavity region formed directly under said optical device in said solder layer region, wherein:
- oxide layers are formed on inner surfaces of said first and/or second electrodes corresponding to said cavity region.
An optical module, comprising:
- an optical device provided with a first electrode formed on a bottom surface thereof,
- a substrate provided with a second electrode formed on a top surface thereof,
- a solder layer region for joining said first and second electrodes, and
- a cavity region formed directly under said optical device in said solder layer region, wherein:
- said optical device is a photosensor.
Dependencies are inferred from the claim text.