Method and apparatus for aligning and connecting semiconductor components to substrates

An apparatus for aligning and connecting a semiconductor component to a substrate comprising:

• a platform assembly for holding the substrate comprising a fixed platform, and a moving platform connected to the fixed platform by a plurality of linear actuators configured to move the moving platform in three translational directions and in three rotational directions;
• a chuck assembly proximate to the platform assembly for holding the component;
• at least one camera proximate to the platform assembly or the chuck assembly configured to obtain images of the component and the substrate;
• at least one distance measuring device proximate to the platform assembly or the chuck assembly configured to obtain distances between the component and the substrate;
• and
• a controller in signal communication with the camera, the distance measuring device and the linear actuators, the controller configured to control movement of the moving platform responsive to signals from the camera and the distance measuring device.

An apparatus for probe testing a semiconductor wafer comprising:

• a probe card comprising a plurality of first contacts for electrically engaging a plurality of second contacts on the wafer;
• a platform assembly for holding the probe card including a fixed platform and a moving platform connected to the fixed platform by a plurality of linear actuators configured to move the moving platform in three translational directions and in three rotational directions;
• at least one camera proximate to the platform assembly or the chuck assembly configured to obtain images of contacts on the wafer and on the probe card;
• at least one distance measuring device proximate to the platform assembly or the chuck assembly configured to obtain distances between the contacts;
• and
• a controller in signal communication with the camera, the distance measuring device and the linear actuators, the controller configured to control movement of the moving platform responsive to signals from the camera and the distance measuring device to place the contacts on the wafer and on the probe card in physical and electrical contact.

An apparatus for testing a semiconductor component comprising:

• a substrate comprising a plurality of first contacts for electrically engaging a plurality of second contacts on the component;
• a hexapod comprising a platform for holding the substrate configured to move in three translational directions and in three degrees rotational directions;
• a chuck proximate to the platform for holding the component;
• at least one camera proximate to the hexapod configured to determine a position and an orientation of the first contacts and the second contacts;
• and
• a controller in signal communication with the camera configured to operate the platform to align and place the first contacts and the second contacts in physical and electrical contact.

An apparatus for attaching a semiconductor component to a substrate comprising:

• a hexapod comprising a platform for holding the component configured to move in three translational directions and in three rotational directions;
• a chuck proximate to the platform for holding the substrate;
• at least one camera proximate to the hexapod configured to determine a position and an orientation of a plurality of first contacts on the component and a plurality of second contacts on the substrate;
• and
• a controller in signal communication with the optical device configured to operate the platform to align and place the first contacts and the second contacts in physical and electrical contact.

An apparatus for wire bonding a semiconductor component to a substrate comprising:

• a wire bonding tool;
• a platform for holding the bonding tool configured to move the bonding tool in three translational directions and in three degrees rotational directions;
• a chuck proximate to the platform for holding the component and the substrate;
• at least one camera proximate to the hexapod configured to determine a position and an orientation of the bonding tool and of contacts on the component and the substrate;
• and
• a controller in signal communication with the camera configured to operate the platform to move the bonding tool for wire bonding wires to the contacts.