Article for de-embedding parasitics in integrated circuits

An integrated circuit comprising:

• a first pad, a first plate, a second pad, and a second plate made from a first conductive layer;
• a substrate;
• a first lead and a second lead made from a second conductive layer that is between said first conductive layer and said substrate, wherein said first lead is electrically connected to said first pad and said second lead is electrically connected to said second pad;
• and
• a third plate and a fourth plate made from a third conductive layer that is between said second conductive layer and said substrate;
• wherein said first lead is sandwiched between said first plate and said third plate and said first lead is electrically connected to said first pad;
• and
• wherein said second lead is sandwiched between said second plate and said fourth plate, and said second lead is electrically connected to said second pad.

An integrated circuit comprising:

• a first pad, a first lead electrically connected to said first pad, a second pad, and a second lead electrically connected to said second pad, wherein said first pad, said first lead, said second pad and said second lead are made from a first conductive layer;
• a substrate;
• a first plate made from a second conductive layer that is between and electrically insulated from said first lead and said substrate;
• a second plate made from said second conductive layer that is between and electrically insulated from said second lead and said substrate;
• and
• a fence made from said first conductive layer that surrounds and is electrically insulated from said first pad and said second pad.

An integrated circuit comprising:

• a first pad, a first lead electrically connected to said first pad, a second pad, and a second lead electrically connected to said second pad, wherein said first pad, said first lead, said second pad and said second lead are made from a first conductive layer;
• a substrate;
• a first plate made from a second conductive layer that is between and electrically insulated from said first lead and said substrate;
• a second plate made from said second conductive layer that is between and electrically insulated from said second lead and said substrate;
• a first conductive trough that partially encloses said first lead, wherein said first conductive trough comprises a rim made from said first conductive layer and a bottom made from said second conductive layer;
• and
• a second conductive trough that partially encloses said second lead, wherein said second conductive trough comprises a rim made from said second conductive layer and a bottom made from said second conductive layer.