Heat sink
AssigneeLegerity, Inc.
InventorsStephen T. Prince, Toby D. Cole, Kevin C. Brundidge, Larry W. Tucker
Life of this patent
Estimating the term…
Abstract
A heat sink includes mounting feet, a plurality of folds, and a clip. Each of the folds has a base portion, and the clip couples at least two of the folds together to inhibit fanning in at least a contact region defined by adjacent base portions. An apparatus includes a printed circuit board, mounting receptacles on the printed circuit board, a heat sink, and a device package. The heat sink includes feet adapted to interface with the mounting receptacles, a plurality of folds, and a base portion defined between the folds. The device package is coupled to the printed circuit board. The base portion of the heat sink contacts at least a portion of the device package.
Claims41
A heat sink, comprising:
- mounting feet;
- a plurality of folds, each having a base portion;
- and
- a clip coupling at least two of the folds together to inhibit fanning in at least a contact region defined by adjacent base portions.
An apparatus, comprising:
- a printed circuit board;
- mounting receptacles on the printed circuit board;
- a heat sink comprising:
- feet adapted to interface with the mounting receptacles;
- a plurality of folds, each having a base portion;
- and
- a clip coupling at least two of the folds together to inhibit fanning in at least a contact region defined by adjacent base portions;
- and
- a device package coupled to the printed circuit board, the contact region of the heat sink contacting at least a portion of the device package.
A method for assembling an electronic device, comprising:
- providing a printed circuit board;
- mounting a device package on the printed circuit board;
- providing mounting receptacles on the printed circuit board proximate the device package;
- forming a heat sink, the heat sink including feet and a plurality of folds, each fold having a base portion;
- coupling the feet of the heat sink to the mounting receptacles;
- and
- coupling at least two of the folds together to inhibit fanning in at least a contact region defined by adjacent base portions, the contact region of the heat sink contacting at least a portion of the device package.
An apparatus, comprising:
- a printed circuit board;
- mounting receptacles on the printed circuit board;
- a heat sink comprising:
- a base portion;
- a plurality of compressible folds extending from the base portion, each of at least two compressible folds terminating in a foot, the foot interfacing with the mounting receptacle and being maintained in position by a spring force generated by a deflection of the at least two compressible folds;
- and
- a plurality of folds;
- and
- a device package coupled to the printed circuit board, the base portion of the heat sink contacting at least a portion of the device package.
An apparatus, comprising:
- a printed circuit board;
- a heat sink comprising:
- a base portion;
- a plurality of compressible folds extending from the base portion, each of at least two compressible folds terminating in a foot;
- and
- means for mounting the feet to the printed circuit board, each foot interfacing with the mounting means and being maintained in position by a spring force generated by a deflection of the at least two compressible folds;
- and
- a device package coupled to the printed circuit board, the base portion of the heat sink contacting at least a portion of the device package.
Dependencies are inferred from the claim text.