Electromagnetic interference shield and gap filler for a circuit board
AssigneeApple Computer, Inc.
InventorsFrancisco Fangonilo, Suinin William Wong
Life of this patent
Estimating the term…
Abstract
A suppression layer made from material that reduces EMI is placed between an circuit board and a heat sink. At least one opening in the suppression layer allows the top surface of at least one electronic component to be thermally coupled to the heat sink. In addition to reducing EMI, the suppression layer fills in the space created between the various components on the circuit board. Filling in the gaps prevents the heat sink from rocking and moving, thereby protecting the at least one component coupled to the heat sink from damage. Filling in the gaps with the suppression layer also allows the heat sink to achieve and maintain secure thermal contact with the at least one electronic component on the circuit board.
Claims6
A system for reducing electromagnetic interference comprising:
- a circuit board having a plurality of electronic components coupled thereto, wherein each of the plurality of electronic components has a top surface;
- a suppression layer having at least one opening therein and overlying at least a portion of the circuit board, wherein the suppression layer is substantially planar and comprised of material that reduces electromagnetic interference;
- and
- a heat sink overlying the suppression layer and at least a portion of the circuit board, wherein the at least one opening in the suppression layer allows the top surface of at least one of the plurality of electronic components to be thermally coupled to the heat sink, and wherein the suppression layer fills in gaps caused by the top surfaces of the plurality electronic components having differing elevations from the circuit board.
A system for reducing electromagnetic interference comprising:
- a circuit board having a microprocessor coupled thereto, the microprocessor having a top surface;
- a suppression layer having an opening therein overlying the microprocessor, wherein the suppression layer is substantially planar and comprised of material that reduces electromagnetic interference;
- and
- a heat sink overlying the suppression layer and at least a portion of the circuit board, wherein the opening in the suppression layer allows the top surface of the microprocessor to be thermally coupled to the heat sink, and wherein the suppression layer fills in gaps around the microprocessor caused by the top surface of the microprocessor having an elevation from the circuit board.
Dependencies are inferred from the claim text.