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US 6,208,511 B1Granted
Arrangement for enclosing a fluid and method of manufacturing a fluid retaining enclosure
AssigneeLucent Technologies Inc.
InventorsJames R. Bortolini, Scott E. Farleigh, Gary J. Grimes, Stephen R. Peck, Charles J. Sherman
Life of this patent
Estimating the term…
Abstract
An arrangement for enclosing a fluid includes a circuit board and an enclosure member. The circuit board includes an electronic component secured thereto. The enclosure member is secured to the circuit board such that the enclosure member and the circuit board cooperate so as to create a fluid tight barrier of a compartment defined by the circuit board and the enclosure member.
Claims8
An arrangement for enclosing a fluid, the arrangement comprising:
- a circuit board having a primary circuit board portion and a secondary circuit board portion integrally secured to said primary circuit board portion;
- an enclosure member secured to said circuit board such that said enclosure member and said primary circuit board portion cooperate so as to create a fluid tight barrier of a compartment defined by said primary circuit board portion and said enclosure member, said secondary circuit board portion being disposed outside of said compartment;
- a first electronic component secured to said primary circuit board portion such that said first electronic component is located within said compartment;
- a second electronic component secured to said secondary circuit board portion such that said second electronic component is located outside of said compartment;
- a liquid disposed within said compartment;
- a gas in contact with said second electronic component;
- and
- a trace which electrically couples said first electronic component and said second electronic component.
5 more elements
Dependencies are inferred from the claim text.