High quality factor capacitor
AssigneeMicrochip Technology Incorporated
InventorsSam E. Alexander, Randy L. Yach, Roger St. Amand
Life of this patent
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Abstract
An improved high quality factor capacitive device is implemented on a single, monolithic integrated circuit. The new layout techniques improve the quality factor (Q) of the capacitor by reducing intrinsic resistance of the capacitor by reducing the distance between the metal contacts of the top and bottom conductive plates. The layout techniques require laying out the top conductive plate of the capacitor in strips such that metal contacts from the bottom conductive plate pass in between the strips and through the dielectric layer. Alternatively, the apertures may be etched into the top conductive plate so that metal contacts pass through the apertures and connect to the bottom conductive plate.
Claims5
An improved high quality factor capacitor, comprising:
- a bottom conductive plate wherein the bottom conductive plate is either of a polycristalline silicon layer that is deposited on a oxidized single crystal silicon substrate or a single crystal silicon substrate doped to provide a capacitance characteristic;
- a dielectric layer coupled to the bottom conductive plate;
- a top conductive plate coupled to the dielectric layer wherein the top conductive plate comprises a plurality of apertures;
- a plurality of metal contacts coupled to the bottom conductive plate wherein at least one of the plurality of metal contacts penetrates at least one of the plurality of apertures without contacting the top conductive plate;
- and
- a second plurality of metal contacts coupled to the top conductive plate;
- wherein the capacitor is implemented on a single, monolithic integrated circuit.
Dependencies are inferred from the claim text.