Methods of forming photoresist and apparatus for forming photoresist

A method of forming a layer of photoresist over a substrate comprising:

• providing a wafer;
• applying photoresist over the wafer;
• rotating the wafer while baking the photoresist;
• and
• halting the rotating during the baking and then continuing baking of the photoresist while the rotating is halted.

A method of forming a layer of photoresist over a substrate comprising:

• providing a semiconductor wafer;
• applying photoresist over the semiconductor wafer;
• positioning the wafer on a rotatable hot plate at a photoresist baking station;
• rotating the rotatable hot plate during at least some of the time the wafer is baked at the baking station;
• and
• wherein the applying of the photoresist comprises providing more photoresist towards the center of the wafer than towards the periphery of the wafer, and wherein said rotating comprises doing so with said photoresist as applied.

A method of forming a layer of photoresist over a substrate comprising:

• applying photoresist over a wafer surface and into a predefined non-uniform thickness over the surface;
• modifying the non-uniform thickness over the surface into a more uniform thickness over the surface while baking the photoresist by moving the wafer during at least some of the baking;
• and
• wherein the applying of the photoresist comprises initially applying said photoresist to be elevationally thicker towards the center of the wafer surface.