Method for the pattern-processing of photosensitive resin composition

Abstract

A method of pattern-processing a photosensitive resin composition which comprises coating on a substrate a positive photosensitive resin composition of a polyamide of formula (1) below and a diazoquinone compound, subjecting the same to prebaking and then to irradiation with light, thereafter dissolving the exposed portion in an alkaline aqueous solution containing an alkylbenzenesulfonic acid to remove the same, thereby obtaining a pattern. wherein X is a tetravalent aromatic group; Y is a divalent aromatic group; Z is in which R1 and R2 are divalent organic groups and R3 and R4 are nonvalent organic groups; a and b are mole fractions; a+b=100 mole %; a=60.0-100 mole %; b=0-40.0 mole % and n=2-500. When the development is effected with the alkaline aqueous solution containing the alkylbenzenesulfonic acid, a scum-free, very high resolution pattern is obtained.

Dependencies are inferred from the claim text.