Dual track stencil/screen printer
AssigneeSpeedline Technologies, Inc.
InventorsDennis G. Doyle, Steven W. Hall
Life of this patent
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AssigneeSpeedline Technologies, Inc.
InventorsDennis G. Doyle, Steven W. Hall
Estimating the term…
A dual track stencil system includes a first set of rails and a second set of rails, each of the rails being independently controlled for allowing for independent movement of circuit boards through the stencil system for processing. The stencil system includes a working area, at which the circuit boards are stenciled. A stencil, having two patterns, each aligned with a respective working area of each track is suspended above the dual track system. A solder dispensing unit including a squeegee arm is suspended above the stencil, parallel to and centered between the two tracks. During operation, a circuit board enters the working area, is raised to engage with the stencil, and the squeegee arm traverses that portion of the stencil pattern currently engaging the board, thereby dispensing solder through the pattern and stenciling the board. The stencil system operates to process two boards on one track before advancing to the second track for processing another pair of boards. The rails of the dual track system are advantageously moveable to allow for variable width boards or operation of the system in single track mode. The stencil system design may be adapted to make the dual track system a recirculating track, capable of supporting pallets for transport and printing of delicate materials. In addition, the stencil system design may be adapted for processing boards in parallel, where the boards are received simultaneously or staggered, placed at a stencil position, and printed with one stroke of the squeegee head.
A method for providing processing of circuit boards in a stenciling system having two tracks, each track having a loader for accepting circuit boards and advancing said boards to like printing positions within said tracks, said stenciling system comprising a stencil having a first pattern and a second pattern, one associated with each track, and a solder dispensing mechanism extendable across the first pattern and the second pattern on the stencil to print material on boards on each of the tracks, said method comprising the steps of:
A method for dispensing solder paste on circuit boards using a system having two tracks, each of which is configured for receiving a circuit board and advancing the circuit board to a working position on the track at which solder paste is dispensed onto the circuit board using a printing mechanism that applies solder paste to the circuit board through a stencil, the method comprising steps of:
A method for dispensing solder paste on circuit boards using a system having two tracks, each of which is configured for receiving a circuit board and advancing the circuit board to a working position on the track at which solder paste is dispensed onto the circuit board using a dispensing mechanism that applies solder paste to the circuit board through a stencil, the method comprising steps of:
A method for dispensing solder paste on circuit boards using a system having two tracks, each of which is configured for receiving a circuit board and advancing the circuit board to a working position on the track at which solder paste is dispensed onto the circuit board,
Dependencies are inferred from the claim text.