Deposition apparatus and related method with controllable edge exclusion

A controllable edge exclusion assembly for controllably excluding deposition adjacent a peripheral edge of a wafer within a deposition chamber and based upon fluid flow, the controllable edge exclusion assembly comprising:

• a ring-shaped body extending inwardly from the peripheral edge of the wafer and spaced above an adjacent front surface of the wafer, the ring-shaped body having a plurality of fluid passageways extending therethrough so that fluid flow from adjacent a back surface of the wafer passes over the peripheral edge of the wafer and through the fluid passageways to thereby exclude deposition adjacent the peripheral edge of the wafer;
• and
• a flow controller adjacent the fluid passageways of said ring-shaped body for controlling fluid flow therethrough.

A controllable edge exclusion assembly for controllably excluding deposition adjacent a peripheral edge of a wafer within a deposition chamber and based upon fluid flow, the controllable edge exclusion assembly comprising:

• a ring-shaped body extending inwardly from the peripheral edge of the wafer and spaced above an adjacent front surface of the wafer, the ring-shaped body having a plurality of fluid passageways extending therethrough so that fluid flow from adjacent a back surface of the wafer passes over the peripheral edge of the wafer and through the fluid passageways to thereby exclude deposition adjacent the peripheral edge of the wafer, and
• a control body having a plurality of fluid passageways therein and being relatively movable with respect to said ring-shaped body.

A controllable edge exclusion assembly for controllably excluding deposition adjacent a peripheral edge of a wafer within a deposition chamber and based upon fluid flow, the controllable edge exclusion assembly comprising:

• a ring-shaped body extending inwardly from the peripheral edge of the wafer and spaced above an adjacent front surface of the wafer, the ring-shaped body having a plurality of fluid passageways extending therethrough so that fluid flow from adjacent a back surface of the wafer passes over the peripheral edge of the wafer and through the fluid passageways to thereby exclude deposition adjacent the peripheral edge of the wafer;
• and
• an iris diaphragm associated with each of the fluid passageways of said ring-shaped body for controlling fluid flow therethrough.