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US 6,206,198 B1Granted
Lightweight, high temperature packing reel for integrated circuits
AssigneeTexas Instruments Incorporated
InventorsClessie Troxtell, Michael Hayden
Life of this patent
Estimating the term…
Abstract
A lightweight packing reel for storing encapsulated semiconductor devices which may be baked for extended periods of time at temperatures sufficiently high to desorb moisture from the packages, and which allows efficient flow of heat and air through the tape and reel assemblage is provided.
Claims8
A packing reel having integrated circuit devices stored therein comprising:
- a) a thermoplastic hub and flanges, dimensionally stable at 130 deg C. for up to 24 hours;
- b) said flanges having a multitude of openings, and
- c) each of said openings placed directly opposite a like opening on the parallel flange so that air currents are allowed to flow through the reel, thereby allowing more uniform heating of the devices and shorter cycle time for heating and cooling.
A packing integrated circuit devices stored therein comprising:
- a) a thermoplastic hub and flanges, dimensionally stable at 130 deg C. for up to 24 hours;
- b) said flanges having a multitude of openings;
- c) said openings reduce the amount of plastic used by about 30%, thereby providing a light weight reel;
- d) each of said openings placed directly opposite a like opening on the parallel flange so that air currents are allowed to flow through the reel, thereby allowing more uniform heating of the devices and shorter cycle time for heating and cooling, and
- e) said reel comprising fibrous polycarbonate.
2 more elements
Dependencies are inferred from the claim text.