Back to results
US 6,205,023 B1Granted
Cooling arrangement comprising for a heat source a heat sink movable on an external sink
AssigneeNEC Corporation
InventorsMakoto Moribe, Hironobu Goto, Kazuki Yoshida
Life of this patent
Estimating the term…
Abstract
In an electronic unit which comprises a heat source, is supported in a casing, and should be kept below an allowable temperature, a movable heat sink is brought into thermal contact with the heat source and an external heat sink of the casing. Preferably, the movable heat sink is movable into and out of the thermal contact with the heat source and is slidably guided by a guide member of the casing. More preferably, a resilient thermal conductive member is interposed between the heat source and the movable heat sink.
Claims14
A cooling arrangement comprising;
- a casing having a hollow space and a pair of guide members connected thereto;
- an external heat sink having an inside surface in communication with the hollow space;
- and
- an electronic unit comprising:
- a heat source element having a principal surface;
- a plug-in member supported on the casing;
- and
- a movable heat sink movably supported on the guide members between a first position in which the movable heat sink does not contact the heat source element and a second position in which a first surface of the movable heat sink is in thermal contact with the principal surface of the heat source element and in which a second surface of the movable heat sink is in thermal contact with the inside surface of the external heat sink.
5 more elements
A cooling arrangement comprising:
- a casing having a hollow space;
- an external heat sink having an inside surface in communication with the hollow space;
- and
- an electronic unit comprising:
- a heat source element having a principal surface;
- a plug-in member supported on the casing, the plug-in member being plugged into the casing in a first direction;
- and
- a movable heat sink movable independent of the plug-in member in a second direction between a first position in which the movable heat sink does not contact the heat source element and a second position in which a first surface of the movable heat sink is in thermal contact with the principal surface of the heat source element and in which a second surface of the movable heat sink is in thermal contact with the inside surface of the external heat sink.
5 more elements
Dependencies are inferred from the claim text.