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US 6,201,682 B1Granted
Thin-film component
AssigneeU.S. Philips Corporation
InventorsJan H. Mooij, Henricus H.M. Wagemans, Joghum P. Venema
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AssigneeU.S. Philips Corporation
InventorsJan H. Mooij, Henricus H.M. Wagemans, Joghum P. Venema
Estimating the term…
A thin-film component, for example a capacitor, a resistor and a coil, as well as combinations thereof. A substrate of an electrically insulating material (preferably glass), is provided with two U-shaped side contacts and with an electrical structure which is electrically connected to both side contacts. A flexible layer (preferably polyimide) is situated between the substrate and at least one of both legs of each of the U-shaped side contacts, which flexible layer is provided directly on the substrate surface, and in that the modules of elasticity of the material of the layer is below 50 GPa. By virtue of this measure, it is achieved that the components demonstrate a better resistance to standard bending tests. As a result, the product-failure percentage is reduced if these components are employed in flexible PCBs or in PCBs which are subjected to a vibration.
A thin-film component comprising a substrate of an electrically insulating material, which substrate is provided with two U-shaped side contacts, each of said U-shaped side-contacts comprising two legs, as well as with an electrical structure, which electrical structure is electrically connected to both side contacts, characterized in that a flexible layer is situated between the substrate and at least one of both legs of each of the U-shaped side contacts, said flexible layer is provided directly onto a surface of the substrate and said flexible layer directly contacts said substrate on an opposite face from said electrical structure and each of the U-shaped side contacts wraps around and contacts said flexible layer and said electrical structure and in that the modulus of elasticity of the material of the flexible layer is smaller than 50 GPa.
Dependencies are inferred from the claim text.