Back to results
US 6,199,625 B1Granted
Stackable heat sink for electronic components
AssigneePSC Computer Products, Inc.
InventorFred Guerrero
Life of this patent
Estimating the term…
Abstract
A stackable heat sink having a core shaft in heat-engaging relation with a semiconductor device and a plurality of individual thin fins having an opening for receiving the core shaft in press fit relation so that a plurality of the fins, when mounted on the shaft, define a plurality of air passageways and the fins and shaft efficiently transfer heat away from the semiconductor device and into the surrounding atmosphere.
Claims6
A stackable heat sink for electronic components comprising:
- a base with an opening;
- a core shaft secured in the base;
- and
- a plurality of thin heat-dissipating fins mounted on said shaft so as to form a plurality of parallel air passages between adjacent fins,
- said shaft upper end extending above the uppermost fin, and additionally comprising a second shaft having a cylindrical opening in the lower end for receiving the upper end of the first shaft, and additional fins mounted on the second shaft, so as to increase the heat-dissipating surface area of the heat sink.
2 more elements
A stackable heat sink assembly comprising:
- a heat sink;
- and
- a base having an opening for securing and biasing said heat sink in heat-conductive relationship to an electronic component, and further including discrete attachment means operable to attach said base to a member upon which said electronic component is mounted;
- said heat sink comprising a core shaft, said shaft having a first section comprising an annular lip and a second section having a smaller diameter than said lip inserted into said opening in said securing means and a plurality of thin heat-dissipating fins mounted on said shaft.
1 more element
Dependencies are inferred from the claim text.