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US 6,191,944 B1Granted
Heat sink for electric and/or electronic devices
AssigneeElectrovac, Fabrikation elektrotechnischer Spezialartikel Gesellschaft m.b.H.
InventorsErnst Hammel, Hermann Holzer
Life of this patent
Estimating the term…
Abstract
A heat sink adapted for use with an electrical and/or electronic device, in particular with a semiconductor chip such as an integrated circuits, or with a casing for such a device, is formed from a material including whiskers.
Claims10
A heat sink assembly for eliminating heat generated by a heat-producing device, comprising:
- a heat sink having a substrate in heat conductive connection with the device and means, depending from the substrate, for enlargement of the transition surface between the heat sink and the ambient atmosphere, said means being formed by whiskers;
- and
- a cover affixed to the substrate and at least partially surrounding the whiskers, said substrate and said cover forming a space which is filled at least partially with a liquid.
Dependencies are inferred from the claim text.