Technique for producing interconnecting conductive links
AssigneeMassachusetts Institute of Technology
InventorJoseph B. Bernstein
Life of this patent
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Abstract
Conductive links are provided between conductive materials, e.g., metals, separated by a non-conductive material, e.g., a silicon based glass material. In a preferred embodiment a single pulse of laser energy is applied to at least one of the conductive materials to produce mechanical strain therein which strain initiates a fracturing of the non-conductive material so as to provide at least one fissure therein extending between the conductive materials. The laser energy pulse further causes at least one of the conductive materials to flow in such fissure to provide a conductive link between the conductive materials. Preferably, the non-conductive material is formed in layers such that an interface between the layers controls the fissures.
Claims4
A device having one or more conductive paths comprising:
- a first metal conductive element preformed on a substrate;
- a second metal conductive element preformed on said substrate on substantially the same plane as said first metal conductive element;
- an insulating material between the first and second conductive elements and having at least one strain induced fracture therethrough extending generally laterally between the first and second conductive elements;
- and
- one or more conductive links between said first and second conductive elements, said one or more conductive links being conductive metal material from at least one of the conductive elements in the strain induced fractures through the insulating material between the first and second conductive elements.
Dependencies are inferred from the claim text.