Bonding lead structure with enhanced encapsulation

A semiconductor chip connection component comprising:

• (a) a support structure having a first surface including a dielectric material and a second surface, said support structure including a central portion and a peripheral portion and one or more gaps extending through said support structure from said first surface to said second surface and substantially between said central portion and said peripheral portion;
• (b) a bus overlying said first surface of said support structure, said bus having an outer edge which overlies said peripheral portion and an inner edge which overlies said one or more gaps so that the inner edge of said bus is aligned over said one or more gaps;
• (c) one or more electrically conductive leads overlying said first surface of said support structure, each said lead having a first end secured to said central portion and a second end secured to the inner edge of said bus, the second end of each said lead overlying one of said gaps and being displaceable relative to said bus in response to force being applied to said lead for engaging a contact on a semiconductor chip after said connection component has been juxtaposed with said semiconductor chip.