US 6,191,471 B1Granted

Tape carrier package with two regions having leds that connect upon folding

AssigneeSharp Kabushiki Kaisha

InventorsShigeki Tamai, Seijirou Gyouten

Life of this patent

Estimating the term…

Loading patent…

Abstract

A tape carrier package is provided with a first region which includes a plurality of input leads for transmitting an input signal between a liquid crystal driver IC chip and a section external to the tape carrier package, and a second region which includes signal transmitting wires for transmitting an input signal among a plurality of the input leads, on one of the surfaces of a tape substrate. Further, in the tape substrate, a folding slit is formed along a boundary between the first region and the second region. The tape substrate is folded into 180 degrees along the folding slit serving as a fold so as to electrically connect a plurality of the input leads and the signal transmitting wires. This arrangement makes it possible to prevent a voltage drop caused by wire resistance.

Claims15

Dependent claims

A tape carrier package, which supports an integrated circuit and transmits a signal between a section external to said tape carrier package and said integrated circuit, comprising:

a tape substrate having a first region and a second region on one of the surfaces thereof,
a plurality of leads which are formed in said first region and transmit a signal between the section external to the tape carrier package and said integrated circuit, and
signal transmitting wires which are formed in said second region and transmit a signal among a plurality of said leads,
wherein said tape substrate can be folded into 180 degrees along a boundary between said first region and said second region such that said first region and said second region face each other, and a plurality of said leads are electrically connected to said signal transmitting wires in a folded state of said tape substrate.

1 more element

Dependencies are inferred from the claim text.