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US 6,191,390 B1Granted
Heating element with a diamond sealing material
AssigneeApplied Komatsu Technology, Inc.
InventorsCarl A. Sorensen, Daniel Winkler
Life of this patent
Estimating the term…
Abstract
A substrate support plate including a heating element for use in a process chamber is described. The heating element includes an outer sheath, a heating filament and a thermally-conductive and electrically insulative sealing material. The sealing material comprises a diamond powder.
Claims19
A heating element comprising:
- a heating filament;
- a sheath surrounding the heating element;
- and
- a sealing material disposed between the sheath and the heating filament and comprising a diamond powder.
1 more element
A substrate support structure for use in a processing chamber, comprising:
- a plate having a top surface for supporting a substrate;
- and
- one or more heating elements associated with the plate, the one or more heating elements including a heating filament, a sheath surrounding the one or more heating element, and an electrically insulating sealing material including a diamond powder disposed between the sheath and the heating filament.
A heating element, comprising:
- a heating filament;
- a sheath surrounding the heating element;
- and
- a sealing material disposed between the sheath and the heating filament and comprising a diamond powder, wherein the diamond powder has a particle size selected to provide the sealing material with a thermal conductivity and an electrical resistivity that are greater than corresponding properties of a ceramic material.
1 more element
Dependencies are inferred from the claim text.