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US 6,191,359 B1Granted
Mass reflowable windowed package
AssigneeIntel Corporation
InventorsKabul S. Sengupta, Carl E. Sklenicka, Deborah L. Thompson, Raul A. Arellano, Naoyuki Nagai, Nobuyuki Takehashi, Kouichiro Nomoto
Life of this patent
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Abstract
A windowed package is capable of withstanding a mass reflow process. During mass reflow, the entire package is subjected to the solder reflow temperature. In one embodiment, the lid comprises a ceramic frame and a glass window.
Claims15
An integrated circuit package comprising:
- a non-ceramic body;
- and
- a lid sealed to the non-ceramic body with a distinct adhesive material, the lid having a transparent window with a ceramic frame, said ceramic frame bordering said transparent window, wherein the integrated circuit package is capable of withstanding a mass reflow process.
An integrated circuit package comprising:
- a plastic mold;
- a lid sealed to the plastic mold with a distinct adhesive material, the lid comprising a ceramic frame bordering a transparent window, wherein the integrated circuit package is capable of withstanding a temperature of 225 degrees C. for up to 90 seconds without the lid becoming unsealed from the plastic mold.
A packaged integrated circuit comprising:
- a mold package forming a cavity;
- a die disposed within the cavity;
- and
- a lid attached to the mold package with an intermediate joining material sealing the cavity, the lid comprising a transparent window, and a ceramic frame, the ceramic frame bordering the transparent window.
1 more element
An integrated circuit package comprising:
- a non-ceramic body;
- a lid comprising a transparent window bordered by a ceramic frame;
- and
- an adhesive material;
- wherein the lid is bonded to the non-ceramic body with the adhesive material, the adhesive material sealing a cavity formed by the inside surfaces of the lid and the non-ceramic body, the cavity suitable for housing an integrated circuit die.
2 more elements
Dependencies are inferred from the claim text.