US 6,191,020 B1 · Conductive interconnection for semiconductor integrated circuit and method of forming the same

Abstract

A conductive interconnection for an integrate circuit between a protected node and a protecting node and its method are disclosed. The conductive interconnection comprises a stacking connector, a routing connector and a top conductive line. The stacking connector is formed to connect the protected node, which is constructed by at least one inner conductive line and at least one conductive plug, alternately. The inner conductive line has a length lower than a threshold value constrained by antenna effect. Moreover, the routing connector, extending toward the stacking connector, is formed to connect the protecting node. The top conductive line is used to connect the stacking connector and the routing connector. Accordingly, the protected node is disconnected from the protecting node prior to the formation of the top conductive line.

Claims15

Dependent claims

A method of forming a conductive interconnection between a protected node and a second node, comprising:

defining a stacking connector connected to the protected node, wherein the stacking connector is constructed and arranged so as to withstand an antenna effect and connects the protected node to a top layer among a plurality of conductive layers;
and
defining a pattern of the conductive layers to define a routing connector for connecting the protected node to the second node;
wherein the routing connector and the stacking connector are disconnected from each other until forming a top conductive line by patterning the top layer.

1 more element

Dependencies are inferred from the claim text.

Conductive interconnection for semiconductor integrated circuit and method of forming the same

Life of this patent

Conductive interconnection for semiconductor integrated circuit and method of forming the same

Life of this patent

Abstract

Claims15