Method for fabricating a shallow trench isolation structure
AssigneeUnited Semiconductor Corp.
InventorsTsung-Yuan Hung, William Lu
Life of this patent
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Abstract
A method for fabricating a shallow trench isolation (STI) structure includes a pad oxide layer and a hard masking layer are sequentially formed over a semiconductor substrate. A trench is formed in the substrate by patterning over the substrate. Then, the hard masking layer is removed to expose the pad oxide layer. An insulating layer is formed over the substrate to fill the trench. Using the pad oxide layer as a polishing stop, a CMP process is performed to polish the insulating layer until the pad oxide layer is exposed. The remained pad oxide within the trench is simultaneously planarized to have a planar top surface without dishing and microscratch. After the pad oxide is removed, the STI structure is accomplished.
Claims10
A method for fabricating a shallow trench isolation (STI) structure on a semiconductor substrate, having a pad oxide layer and a silicon nitride layer as a masking layer sequentially formed over the substrate, and having a trench formed in the substrate through the pad oxide layer and the masking layer, the method comprising:
- removing the masking layer to expose the pad oxide layer;
- forming an insulating layer directly on the exposed pad oxide layer to fill the trench;
- performing a chemical mechanical polishing (CMP) process, using the pad oxide layer as a polishing step, to planarize the insulating layer until the pad oxide layer is exposed;
- and
- removing the pad oxide layer.
A method for fabricating a shallow trench isolation (STI) structure on a semiconductor substrate, the method comprising:
- sequentially forming a pad oxide layer and a silicon nitride layer as a masking layer over the substrate;
- patterning over the substrate to form a trench, which is through the pad oxide layer, the masking layer, and further down into the substrate;
- removing the masking layer to expose the pad oxide layer;
- forming an insulating layer directly on the exposed pad oxide layer to fill the trench;
- performing a chemical mechanical polishing (CMP) process, using the pad oxide layer as a polishing step, to planarize the insulating layer until the pad oxide layer is exposed;
- and
- removing the pad oxide layer.
Dependencies are inferred from the claim text.